Potting And Encapsulating – Avoiding Voids
Published: |
August 11, 2021 |
Author: |
Paul Whitehead |
Abstract: |
Formulators of multi-component adhesives, potting and encapsulation materials are careful not to supply products with entrapped air. They do this by manufacturing under vacuum or degassing them before supplying to the end user. Consequently, entrapped air in a mixed material is usually a processing issue.... |
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