Package-on-Package (PoP) for Advanced PCB Manufacturing Process
Published: |
December 16, 2021 |
Author: |
Joseph Y. Lee, Jinyong Ahn, JeGwang Yoo, and Shuichi Okabe |
Abstract: |
In the 1990's, both BGA (Ball Grid Array) and CSP (Chip Size Package) are entering their end in the front-end packaging materials and process technology. Both BGA and CSP like SMD (Surface Mount Device) from the I 980's and THD (Through-Hole mount Device) from the 1970's are reaching its own impasse in terms of maximizing its electrical, mechanical, and thermal performances, size, weight, and reliability.... |
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