Investigation of Impacts on Printed Circuit Board Laminated Composites Caused by Surface Finish Application
Published: |
December 29, 2021 |
Author: |
Denis Froš , Karel Dušek and Petr Veselý |
Abstract: |
The purpose of this study was to compare the strength of the bond between resin and glass cloth for various composites (laminates) and its dependence on utilized soldering pad surface finishes. Moreover, the impact of surface finish application on the thermomechanical properties of the composites was evaluated. Three different laminates with various thermal endurances were included in the study. Soldering pads were covered with OSP and HASL surface finishes. The strength of the cohesion of the resin upper layer was examined utilizing a newly established method designed for pulling tests.... |
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