New Laser-Based PCB Depaneling Method from Coherent Increases Process Utilization

Technological changes in the materials, thickness, and composition of PCBs are motivating a move away from traditional mechanical cutting and depaneling methods towards laser-based processes. But not all lasers for PCB depaneling are created equal. There are significant differences amongst various lasers in cut characteristics and quality, specifically in terms of heat affected zone (HAZ). This, in turn, affects process utilization since it determines how closely circuits can be placed on a PCB, and can also impact circuit functionality and downstream processes like waterproofing or EMI shielding. This document presents a new nanosecond laser and associated cutting process developed at Coherent Inc. which enables laser PCB depaneling with substantially reduced HAZ compared to other currently available products.