Whisker Formation Induced by Component and Assembly Ionic Contamination
Published: |
February 13, 2023 |
Author: |
POLINA SNUGOVSKY, STEPHAN MESCHTER, ZOHREH BAGHERI, EVA KOSIBA, MARIANNE ROMANSKY, and JEFFREY KENNEDY |
Abstract: |
This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85_C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.... |
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