Printable Electronics: Towards Materials Development And Device Fabrication

Published:

March 13, 2023

Author:

Rabindra N. Das, How T. Lin, John M. Lauffer and Voya R. Markovich

Abstract:

Purpose – There has been increasing interest in the development of printable electronics to meet the growing demand for low-cost, large-area, miniaturized, flexible and lightweight devices. The purpose of this paper is to discuss the electronic application of novel printable materials. Design/methodology/approach – The paper addresses the utilization of polymer nanocomposites as it relates to printable and flexible technology for electronic packaging. Printable technology such as screen-printing, ink-jet printing, and microcontact printing provides a fully additive, non-contacting deposition method that is suitable for flexible production....

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Company Information:

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Manufacturer

  • Phone 866 820-4820
  • Fax 607 755-7000

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Company Postings:

(3) products in the catalog

(21) technical library articles

(26) news releases

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