Modeling Resistance Increase In A Composite Ink Under Cyclic Loading
Published: |
March 13, 2023 |
Author: |
Q Li, E Chung, A Antoniou and O Pierron |
Abstract: |
The electrical performance of stretchable electronic inks degrades as they undergo cyclic deformation during use, posing a major challenge to their reliability. The experimental characterization of ink fatigue behavior can be a time-consuming process, and models allowing accurate resistance evolution and life estimates are needed. Here, a model is proposed for determining the electrical resistance evolution during cyclic loading of a screen-printed composite conductive ink. The model relies on two input specimen-characteristic curves, assumes a constant rate of normalized resistance increase for a given strain amplitude, and incorporates the effects of both mean strain and strain amplitude. The model predicts the normalized resistance evolution of a cyclic test with reasonable accuracy. The mean strain effects are secondary compared to strain amplitude, except for large strain amplitudes (>10%) and mean strains (>30%). A trace width effect is found for the fatigue behavior of 1 mm vs 2 mm wide specimens. The input specimen-characteristic curves are trace-width dependent, and the model predicts a decrease in Nf by a factor of up to 2 for the narrower trace width, in agreement with the experimental results. Two different methods are investigated to generate the rate of normalized resistance increase curves: uninterrupted fatigue tests (requiring ∼6–7 cyclic tests), and a single interrupted cyclic test (requiring only one specimen tested at progressively higher strain amplitude values). The results suggest that the initial decrease in normalized resistance rate only occurs for specimens with no prior loading. The minimum-rate curve is therefore recommended for more accurate fatigue estimates.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Georgia Institute of Technology »
- Mar 16, 2023 - Conductive Anodic Filament (CAF) Formation: A Potential Reliability Problem for Fine-Line Circuits
- Mar 16, 2023 - Conductive Anodic Filament Failure: A Materials Perspective
- Mar 13, 2023 - Printed Electronics: Manufacturing Technologies and Applications
- Feb 09, 2022 - Additively Manufactured mm-Wave Multichip Modules With Fully Printed "Smart" Encapsulation Structures
- Aug 19, 2020 - All-in-One, Wireless, Stretchable Hybrid Electronics for Smart, Connected, and Ambulatory Physiological Monitoring
- See all SMT / PCB technical articles from Georgia Institute of Technology »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Modeling Resistance Increase In A Composite Ink Under Cyclic Loading article has been viewed 289 times