Staking/Epoxy Adhesive Dispensing for Aerospace
Published: |
August 16, 2023 |
Author: |
GPD Global, Inc. |
Abstract: |
One of our aerospace customers was looking to automate a few manual operations and asked for suggestions. This customer specializes in assemblies for inflight connectivity for commercial airlines and low orbit satellites. The dispensing process included the application of bonding to the sides of large and small components (4-axis) and the ability to cope with the changing viscosity during processing. The material used was EC-2216 B/A Two Part Epoxy and the largest board size was 12"x10"... |
You must be a registered user to talk back to us. |
Company Information:
More articles from GPD Global »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications
- Mar 19, 2024 - What is Underfill
- Sep 07, 2023 - Conductive Adhesive Dispensing for Electronic Manufacturing
- Sep 07, 2023 - Small Volume Solder Paste Dispensing for Aerospace and Defense
- See all SMT / PCB technical articles from GPD Global »
More SMT / PCB assembly technical articles »
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Staking/Epoxy Adhesive Dispensing for Aerospace article has been viewed 568 times