Head-On-Pillow Defect – A Pain in the Neck or Head-On-Pillow BGA Solder Defect
Published: |
September 5, 2023 |
Author: |
Chris Oliphant, Bev Christian, Kishore Subba-Rao, Fintan Doyle, Laura Turbini, David Connell and Jack Q. L. Han |
Abstract: |
The head on pillow defect is becoming more common. This paper describes one such occurrence for an OEM and explains how it was dealt with. In this particular case it was solved by application of problem solving skills by the OEM, component supplier and the solder paste provider... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Research In Motion »
- Nov 08, 2012 - Elemental Compositions of Over Two Dozen Cell Phones
- Sep 09, 2010 - Cleanliness of Stencils and Cleaned Misprinted Circuit Boards
- See all SMT / PCB technical articles from Research In Motion »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Head-On-Pillow Defect – A Pain in the Neck or Head-On-Pillow BGA Solder Defect article has been viewed 226 times
diethealthy
September 15, 2024
h