Dispensing: A Robust Process Solution for Shield Edge Interconnect
Published: |
November 6, 2023 |
Author: |
Rajiv L. Iyer and Michael L. Martel |
Abstract: |
A new process has been developed for RF shielding on compact electronic communications devices using automated solder paste dispensing. The process is known as Shield Edge Interconnect (SEI). SEI designs enable parts to be processed though underfill before placing of the RF shield and allows more complete use of valuable PCB real estate to achieve reduced form factor requirements and/or for added components on products such as smartphones and tablets. The reduced form factor creates challenges for the assembly of those devices. This process, enabled by Speedline dispensing technology, relies on extremely accurate dispensing of solder paste on copper traces located along the outer edge of the PCB. The result is a robust process solution for SEI in which proprietary closed loop dispenser, pump, vision, and software technologies enable a high volume manufacturing (HVM) process.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Speedline Technologies, Inc. »
- Nov 17, 2021 - Effect of Nano-Coated Stencil on 01005 Printing
- Jun 15, 2021 - Enabling Advanced Assembly and Packaging with Automated Dispensing
- Aug 06, 2015 - Enclosed Media Printing as an Alternative to Metal Blades
- Jun 17, 2010 - Effect Of Squeegee Blade On Solder Paste Print Quality
- May 06, 2010 - Effect Of Board Clamping System On Solder Paste Print Quality
- See all SMT / PCB technical articles from Speedline Technologies, Inc. »
More SMT / PCB assembly technical articles »
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Dispensing: A Robust Process Solution for Shield Edge Interconnect article has been viewed 171 times