Non-Destructive Characterization of Mechanically Processed Waste Printed Circuit Boards: X-ray Fluorescence Spectroscopy and Prompt Gamma Activation Analysis
Published: |
May 28, 2024 |
Author: |
Akira Otsuki , Pedro Pereira Gonçalves , Christian Stieghorst and Zsolt Révay |
Abstract: |
This work aimed to characterize the deportment/concentration and liberation/association |
You must be a registered user to talk back to us. |
Company Information:
More SMT / PCB assembly technical articles »
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Non-Destructive Characterization of Mechanically Processed Waste Printed Circuit Boards: X-ray Fluorescence Spectroscopy and Prompt Gamma Activation Analysis article has been viewed 133 times