Underfill Materials Dispensing in Electronics Manufacturing Applications
Published: |
August 20, 2024 |
Author: |
GPD Global |
Abstract: |
In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.... |
|
Company Information:
More articles from GPD Global »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation
- Mar 19, 2024 - What is Underfill
- Sep 07, 2023 - Conductive Adhesive Dispensing for Electronic Manufacturing
- Sep 07, 2023 - Small Volume Solder Paste Dispensing for Aerospace and Defense
- Aug 16, 2023 - Staking/Epoxy Adhesive Dispensing for Aerospace
- See all SMT / PCB technical articles from GPD Global
»
More SMT / PCB assembly technical articles »
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Underfill Materials Dispensing in Electronics Manufacturing Applications article has been viewed 7 times