Common failure mechanisms in conformal coating: Delamination
Published: |
September 2, 2024 |
Author: |
SCH TTechnologies |
Abstract: |
In conformal coating, there are several mechanisms that cause failure of printed circuit boards (PCBs). In a series of technical bulletins SCH will examine the common failure mechanisms in conformal coating including capillary flow, delamination, cracking, loss of adhesion, dewetting, corrosion, orange peel, pinholes, bubbles and foam.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from SCH Technologies »
- Nov 06, 2013 - Setting Up a Conformal Coating Facility
- Oct 22, 2013 - Successful Conformal Coating Masking
- Oct 13, 2013 - Conformal Coating Thickness Measurement
- Oct 13, 2013 - Designing Circuit Boards for Selective Robotic Coating Application
- Oct 13, 2013 - Choosing the Right Valve for a Selective Robotic Conformal Coating Application Process
- See all SMT / PCB technical articles from SCH Technologies »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Common failure mechanisms in conformal coating: Delamination article has been viewed 98 times