Underfill Materials Dispensing in Electronics Manufacturing Applications
Published: |
August 29, 2025 |
Author: |
GPD Global |
Abstract: |
In electronics manufacturing, "underfill" refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit. It is also important in 3D ICs and advanced packaging technologies that involve stacking multiple chips or integrating multiple functions into a single package.... |
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