Miniaturization of Cooling Solutions
Published: |
May 6, 1999 |
Author: |
Christopher Chapman, Aavid Thermal Products, Inc. |
Abstract: |
The market's demand for increasingly powerful products, in smaller and smaller packaging, creates a cooling problem. Integrated circuit (IC) lifetime is dependent upon its operating temperature, creating a trade-off situation: either you enlarge the package to accept additional cooling, or you sacrifice IC lifetime.... |
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