Thermal Engineering Overview.
Published: |
May 6, 1999 |
Author: |
Craig Johnston, Gary Kuzmin, Aavid Engineering, Inc. |
Abstract: |
The present problem with cooling microprocessors is a relatively new issue -- about 4 years old. It stems from the collision of two conflicting trends -- end-user desire for more powerful microprocessors to run the next generation software, and the equally strong demand for smaller, more mobile computer form factors. With each, the introduction of faster next-generation semiconductors aimed at improving computing power, heat concentration problems increase.... |
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