Solder Volumes for Through-Hole Reflow-Compatible Connectors
Published: |
May 6, 1999 |
Author: |
AMP Incorporated |
Abstract: |
The success of surface-mount technology has not meant the end of through-hole connectors. For reasons ranging from availability to user concerns over reliability, through-hole connectors remain widely used. ... |
|
Company Information:
More articles from TE Connectivity »
- Sep 04, 2019 - Full Material Declarations: Removing Barriers to Environmental Data Reporting
- May 07, 1999 - Stereolithography and Simultaneous Engineering Speed Products to Market
- May 06, 1999 - Keeping Tin Solderable
- May 06, 1999 - Specifying Current for the Real World
- See all SMT / PCB technical articles from TE Connectivity »
More SMT / PCB assembly technical articles »
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Solder Volumes for Through-Hole Reflow-Compatible Connectors article has been viewed 801 times