Solder Volumes for Through-Hole Reflow-Compatible Connectors

Published:

May 6, 1999

Author:

AMP Incorporated

Abstract:

The success of surface-mount technology has not meant the end of through-hole connectors. For reasons ranging from availability to user concerns over reliability, through-hole connectors remain widely used. ...

  • Download Solder Volumes for Through-Hole Reflow-Compatible Connectors article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 

Company Information:

A technology leader in the world's fastest growing markets, helping connect power, data and signal in everything from automotive and aerospace to broadband communications, consumer, energy and industrial applications.

Schaffhausen, Switzerland

Manufacturer, Standards Setting / Certification, Training Provider

  • Phone +41 (0) 52 633 66 77
  • Fax +44 1494 464099

See Company Website »

Company Postings:

(5) technical library articles

(67) news releases

  • Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
  • Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
  • Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
  • Mar 19, 2024 - What is Underfill | GPD Global
  • Browse Technical Library »

Solder Volumes for Through-Hole Reflow-Compatible Connectors article has been viewed 807 times

Find Replacement SMT Nozzles and Feeders

SMT spare parts - Qinyi Electronics