Characterization of No Clean Solderpaste Residues: The Relationship to In-Circuit Testing
Published: |
May 7, 1999 |
Author: |
Merlin Kister, Kester Solder |
Abstract: |
Many manufacturers have now completed the conversion to no clean solder paste. Many factors governed this initial conversion, among those being cosmetics, solder ability, and process ability. In circuit testing or probing through no clean solder paste residues has topically not been a major factor in the conversion decision for several reasons. Due to board design, solder paste was only used on one side of the board and not subjected to testing...... |
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