Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

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1857 SMT / PCB Assembly Related Technical Articles

How to Calculate Laser Cutting Costs and Laser Cutting Time

Aug 05, 2024 | A-Laser

A review of the factors involved in calculating the the cost of laser cutting and how laser cutting time is also calculated....

Publisher: A-Laser, Inc.

A-Laser, Inc.

Custom laser cutting services and precision parts manufacturing.

Milpitas, California, USA

Consultant / Service Provider, Manufacturer

The next step for power-efficient memory performance in client laptops

Jul 30, 2024 | Micron Corp

With increasing market demand for high-performance client laptops with long battery life, LPCAMM2 provides a comprehensive, smaller, lighter, modular solution for delivering speed at low power. Platform designers can configure LPCAMM2 with their preferred capacity and logical ranks using just one connector, further enabling customers to scale their client solutions....

Publisher: MICRON CORP.

MICRON CORP.

When quality, cost, and time are considerations in the production of your assembly needs consider Micron Corporation

Nowrwood, Massachusetts, USA

Rethinking the Evolution of the PC industry

Jul 30, 2024 | Dell Inc

The computer industry is one of continual innovation and development, pushing the boundaries of possibility with constantly evolving products. As user needs and demands constantly change and increase, the industry must ensure products meet not just current demands, but also future requirements - resulting in faster, higher performing PCs and hardware. The foundation that this culture of innovation is built on is standards. Widely accepted and utilized standards are necessary to ensure a level playing field throughout any industry, and serve as the building blocks that future innovations can be built on. Standardization of technology is necessary to ensure products not only meet user needs consistently and reliably, but also ensures a level of guaranteed functionality and stability for industry innovators to improve upon. In turn, these advances can offer industrywide improvements and user benefits that then set the new industry standard, becoming the recognized baseline of efficiency and effectiveness that the next generation of innovation is built on....

Publisher: Dell Inc

Dell Inc

Dell is an American company that develops, sells, repairs, and supports computers and related products and services, and is owned by its parent company of Dell Technologies.

Round Rock, Texas, USA

Manufacturer

The CAMM2 Journey and Future Potential

Jul 30, 2024 | Tom Schnell, Joe Mallory

The CAMM2 Journey and Future Potential • A short history of the CAMM2 journey since 2020 • Details on LPDDR5 CAMM2 and DDR5 CAMM2 • The future work and potential of CAMM2...

Publisher: JEDEC Solid State Technology Association

JEDEC Solid State Technology Association

JEDEC is the global leader in developing open standards for the microelectronics industry, with more than 3,000 volunteers representing nearly 300 member companies.

Arlington, Virginia, USA

Association / Non-Profit

The Difference Between Peek Waterjet Cutting and Peek Laser Cutting

Jul 30, 2024 | A-Laser

Reviews the methods of waterjet and laser cutting of PEEK materials....

Publisher: A-Laser, Inc.

A-Laser, Inc.

Custom laser cutting services and precision parts manufacturing.

Milpitas, California, USA

Consultant / Service Provider, Manufacturer

Can You Laser Cut FR4?

Jul 29, 2024 | A-Laser

A review of how FR4 is laser and for applications....

Publisher: A-Laser, Inc.

A-Laser, Inc.

Custom laser cutting services and precision parts manufacturing.

Milpitas, California, USA

Consultant / Service Provider, Manufacturer

Materials Used For Laser Cut Mesh Components

Jul 25, 2024 | A-Laser

A list of materials often used in laser cutting to produce mesh components....

Publisher: A-Laser, Inc.

A-Laser, Inc.

Custom laser cutting services and precision parts manufacturing.

Milpitas, California, USA

Consultant / Service Provider, Manufacturer

A Word About SomaBlack Material

Jul 24, 2024 | A-Laser

What is SomaBlack material and applications....

Publisher: A-Laser, Inc.

A-Laser, Inc.

Custom laser cutting services and precision parts manufacturing.

Milpitas, California, USA

Consultant / Service Provider, Manufacturer

Effect of Thermal via Design on Heat Dissipation of High-Lead QFN Packages Mounted on PCB

Jul 24, 2024 | Ziyi Yuan, Dongyan Ding and Wenlong Zhang

The quad flat no-lead package (QFN) is widely used in integrated circuits due to its
advantages in performance and cost. With the increasing power of electronic products, effective
heat dissipation from QFN packages has become crucial to prevent product damage. The focus of
this study is to investigate the thermal performance of QFN packages soldered onto printed circuit
boards (PCB) by finite element analysis (FEA). Conventional QFN, dual-row QFN, and high-lead
QFN packages were modeled and compared by ANSYSY software. The effect of thermal via design
(the distance, number, distribution, diameter, and thickness of thermal vias) on the QFN package
was investigated. The study revealed that the high-lead QFN package consistently demonstrated
superior heat dissipation performance than the other two under different conditions. Placing thermal
vias closer to the heat source enhances heat dissipation efficiency. Thermal vias positioned beneath
the thermal pad were particularly effective. Increasing thermal via quantity and diameter improved
heat dissipation, with square distribution layouts showing advantages. However, excessive copper
plating thickness can increase thermal resistance and hinder heat dissipation.

...

Publisher: Shanghai Jiao Tong University

Shanghai Jiao Tong University

Shanghai Jiao Tong University (SJTU) was founded in Shanghai, China, in 1896, with the goal of cultivating talented professionals for the nation. Today, SJTU has become one of the world's top 100 universities and a ...

Shanghai, China

Research Institute / Laboratory / School

CORRELATION BETWEEN CALCULATION AND PRACTICE FOR SIMPLE TOP-TO-BOTTOM PCB HEAT DISSIPATION USING TIM & VIAS

Jul 24, 2024 | Andreas Nadler, Markus Eberle

A study of the Thermo Design PCB Indicates The better the performance of the heatsink (=low Rth), the more influence the TIMs have  The thickness of a TIM is often more critical than the thermal conductivity of the material  The thermal resistance of the surface between the materials are most critical  Better use many small vias than a few big vias!  Plated or filled vias are very expensive to get, better try to stay with standard!...

Publisher: Würth Elektronik GmbH & Co. KG

Würth Elektronik GmbH & Co. KG

We produce circuit boards from your specifications in various designs.

Niedernhall, Germany

Consultant / Service Provider, Manufacturer

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