Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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1867 SMT / PCB Assembly Related Technical Articles

Via Hole Filling Technology for High Density, High Aspect Ratio Printed Wiring Boards Using a High Tg, low CTE Plugging Paste

Feb 06, 2023 | Michael Carano

The continued fast pace towards miniaturization is leading circuit board designers to push the envelope on integration density. This trend is driving fabricators to closely look at methods and processes that will enable the move towards sequential lamination and blind and buried via technology. Circuit board fabricators particularly in North America are adopting techniques such as via filling capability with nonconductive, high Tg, low CTE plugging pastes. This paper describes the implementation of the via filling process in a highly effective and reliable fashion for high density, high aspect ratio printed wiring boards. Close attention is paid to use of these via filling materials under high temperature assembly conditions. In addition, via plugging material requirements, equipment considerations and process limitations will be presented. Further, the pros and cons of different filling techniques are discussed. Finally, desmear and metallization techniques to insure adhesion of the plating to the filled via are presented in the context of “Best Practices.”

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Publisher: Omg Electrochemicals / Macdermid Alpha

Omg Electrochemicals / Macdermid Alpha

A global diversified specialty chemicals company focused on providing innovative solutions across several large and growing end-markets that enhance the products of everyday life.

Maple Plain, Minnesota, USA

Manufacturer

PCB Quality Metrics that Drive Reliability

Jan 23, 2023 | Bhanu Sood, Ph.D.

PDC Outline Section 0: Intro Section 1: What is reliability and root cause? Section 2: Overview of failure mechanisms Section 3: Failure analysis techniques – Non-destructive analysis techniques – Destructive analysis – Materials characterization Section 4: Summary and closure...

Publisher: NASA Office Of Safety And Mission Assurance

NASA Office Of Safety And Mission Assurance

The Office of Safety and Mission Assurance (OSMA) assures the safety and enhances the success of all NASA activities through the development, implementation and oversight of agencywide safety, reliability, maintainability and ...

Washington, District of Columbia, USA

Research Institute / Laboratory / School

The Inline X-Ray Component Counter: The Next Step in SMT Inventory Automation

Jan 22, 2023 | Neotel Technology

The inline X-ray component counter, Neo Counter X800, can receive materials from an automated guided vehicle (AGV) or manually loaded by a trolley. The materials are picked up by a robotic arm and sent to the counter for counting. After the counting process, the software records the results and automatically prints a label with the correct quantity. This label is then attached to the surface of the reel. A stacker stacks the materials before being unloaded by the AGV or trolley. This process ensures accurate counting, efficient labelling, and streamlined material handling, making it a convenient way of managing electronic component inventory....

Publisher: Neotel Technology Co., Ltd

Neotel Technology Co., Ltd

Neotel Technology is a leading global developer and manufacturer of automation technology covering material management, soldering, assembly and many others.

Shanghai, Shanghai, China

Manufacturer

Introducing Closed-loop Nitrogen Control To Solder Reflow

Jan 17, 2023 | David Heller

To achieve higher levels of consistency in PCB output, process engineers are able to maintain tighter controls and reduce process-related defects by using closed-loop process controls. At every stage of assembly, from screen printing through placement to reflow, closed-loop systems help control the variable factors that can have adverse effects on the process....

Publisher: Heller Industries Inc.

Heller Industries Inc.

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Florham Park, New Jersey, USA

Manufacturer

How Challenging Conventional Wisdom Can Optimize Solder Reflow

Jan 17, 2023 | Marc Peo

As a manufacturing technology, SMT has acquired a "heritage" of widely accepted assumptions about its processes. However, yesterday'spractices are continually confronted by the shifting paradigms of today's production line....

Publisher: Heller Industries Inc.

Heller Industries Inc.

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Florham Park, New Jersey, USA

Manufacturer

The User Benefits of a Supplier Partnership

Jan 17, 2023 | Bjorn Dahle, Marc Peo

EQUIPMENT SUPPLIERS HAVE BECOME A RESOURCE FOR PROCESS CONTROL EXPERTISE, EVEN IN THE REFLOW OPERATION....

Publisher: Heller Industries Inc.

Heller Industries Inc.

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Florham Park, New Jersey, USA

Manufacturer

Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications

Jan 17, 2023 | Yue Deng, Xike Zhao, Liang He, David Wright, Hossein Madanipour, Bret Halbe, Jung Kyu, Fred Tarazi, Gang Duan, Dror Trifon, Rahul Manepalli, David Heller

Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process....

Publisher: Heller Industries Inc.

Heller Industries Inc.

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Florham Park, New Jersey, USA

Manufacturer

Flux Management

Jan 17, 2023 | Heller Industries

This paper describes the new flux management systems that Heller Industries introduced in 1999....

Publisher: Heller Industries Inc.

Heller Industries Inc.

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Florham Park, New Jersey, USA

Manufacturer

Function and Operational Theory of Condenser Tube Flux Collection System

Jan 17, 2023 | Heller Industries

Heller's new Condenser Tube Flux Recovery System is designed to provide more efficient flux collection than earlier Heller flux collection systems; while providing minimal down time for inspection and cleaning. The entire system easily fits within the rear of the top shell of an 1800-EXL oven. The system utilizes a different set of top shell caps specially designed to provide the best serviceability of both the flux collection system and maintenance of the heater zone blower motors....

Publisher: Heller Industries Inc.

Heller Industries Inc.

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Florham Park, New Jersey, USA

Manufacturer

Repeatability of the Temperature Profile under Load Variation

Jan 17, 2023 | Prepared by: John Poling

Repeatability of the Temperature Profile under Load Variation...

Publisher: Heller Industries Inc.

Heller Industries Inc.

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Florham Park, New Jersey, USA

Manufacturer

Reflow Oven

Circuit Board, PCB Assembly & electronics manufacturing service provider