Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

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1857 SMT / PCB Assembly Related Technical Articles

3 axis two 2 component ccd visual glue dispensing machine automatic AB glue epoxy resin dispenser mixing potting machine robot

Jul 06, 2024 | KPD automatic-

3 axis two 2 component ccd visual glue dispensing machine automatic AB glue epoxy resin dispenser mixing potting machine robot #mixing #metering #Pouring #potting #dispensing #Dosing #encapsulating #spraying #sealing #filling #casting equipment...

Publisher: Kapton Automation Equipment (Guangzhou) Co., Ltd

Kapton Automation Equipment (Guangzhou) Co., Ltd

2 component resin meter mix dispense system 2 component glue potting machine 2 component ab glue dispenser ab resin dosing machine, ab resin mixing machine, Potting and encapsulation machine

guangzhou, Guangdong, China

Manufacturer

Peek Material and What industries Use It

Jul 02, 2024 | A-Laser

What is Peek and how is it used in industry applications....

Publisher: A-Laser, Inc.

A-Laser, Inc.

Custom laser cutting services and precision parts manufacturing.

Milpitas, California, USA

Consultant / Service Provider, Manufacturer

Grafoil Material-What is it and How it is Used.

Jul 01, 2024 | A-Laser

Informative overview of Grafoil material....

Publisher: A-Laser, Inc.

A-Laser, Inc.

Custom laser cutting services and precision parts manufacturing.

Milpitas, California, USA

Consultant / Service Provider, Manufacturer

SOMABLACK

Jun 28, 2024 | Abby Young

SOMABLACK, produced by Somar Corporation, is rapidly becoming the top choice for many applications that require low to zero light reflectivity. It is a polyester-based material, mixed with black carbon to create something that both shades light and reduces reflection, while also having excellent dimensional stability. It is available in a range of options, with varying thicknesses, specular glossiness, optical density, and coatings....

Publisher: A-Laser, Inc.

A-Laser, Inc.

Custom laser cutting services and precision parts manufacturing.

Milpitas, California, USA

Consultant / Service Provider, Manufacturer

UV Lasers and Kapton

Jun 26, 2024 | A-Laser

How UV lasers cut Kapton and where you can find more information about it....

Publisher: A-Laser, Inc.

A-Laser, Inc.

Custom laser cutting services and precision parts manufacturing.

Milpitas, California, USA

Consultant / Service Provider, Manufacturer

Effects of Flux and Reflow Parameters on Lead-Free Flip Chip Assembly

Jun 23, 2024 | Sandeep Tonapi, Peter Borgesen, Ph.D. K. Srihari, Ph.D

The melting temperatures of most lead-free solder alloys are somewhat higher than that of eutectic Sn/Pb solder, and many of the alloys tend to wet typical contact pads less readily. This tends to narrow down the fluxing and mass reflow process windows for assembly onto typical organic substrates and may enhance requirements on placement accuracy. Flip chip assembly here poses some unique challenges. The small dimensions provide for particular sensitivities to wetting and solder joint collapse, and underfilling does not reduce the demands on the intermetallic bond strength. Rather, the need to underfill lead to additional concerns in terms of underfill process control and reliability. Relatively little can here be learned from work on regular SMT components, BGAs or CSPs....

Publisher: Binghamton University

Binghamton University

Binghamton as an institution is dedicated to higher education, one that combines an international reputation for graduate education, research, scholarship and creative endeavor with the best undergraduate programs available at ...

Binghamton, New York, USA

Research Institute / Laboratory / School

EFFECT OF PROCESS THERMAL HISTORY ON THE MICROSTRUCTURE OF COPPER PILLAR SnAg SOLDER JOINTS

Jun 23, 2024 | Mohammed Genanu, Jim Wilcox , Eric Cotts, Jae Joon Choi, Ki Seok Kim

Two extremes of reflow time scale for copper pillar flip chip solder joints were explored in this study. Sn-2.5Ag solder capped pillars were joined to laminate substrates using either conventional forced convection reflow or the controlled impingement of a defocused infrared laser. The laser reflow joining process was accomplished with an order of magnitude reduction in time above liquidus and a similar increase in solidification cooling rate. The brief reflow time and rapid cooling of a laser impingement reflow necessarily affects all time and temperature dependent phenomena characteristic of reflowed molten solder. These include second phase precipitate dissolution, base metal (copper) dissolution, and the extent of surface wetting. This study examines the reflow dependent microstructural aspects of flip chip Sn-Ag joints on samples of two different size scales, the first with copper pillars of 70μm diameter on 120μm pitch and the second with 23μm diameter pillars on a 40μm pitch. The length scale of Pb-free solder joints is known to affect the Sn grain solidification structure; Sn grain morphology will be noted across both reflow time and joint length scales. Sn grain morphology was further found to be dependent on the extent of surface wetting when such wetting circumvented the copper diffusion barrier layer. Microstructural analysis also will include a comparison of intermetallic structures formed; including the size and number density of second phase Ag3Sn precipitates in the joint and the morphology and thickness of the interfacial intermetallics formed on the pillar and substrate surfaces....

Publisher: Binghamton University

Binghamton University

Binghamton as an institution is dedicated to higher education, one that combines an international reputation for graduate education, research, scholarship and creative endeavor with the best undergraduate programs available at ...

Binghamton, New York, USA

Research Institute / Laboratory / School

Metal Plating Services

Jun 21, 2024 | Abby Young

Explanation of metal plating services and its benefits...

Publisher: A-Laser, Inc.

A-Laser, Inc.

Custom laser cutting services and precision parts manufacturing.

Milpitas, California, USA

Consultant / Service Provider, Manufacturer

Case study: Precise Coating on Electronic Hearing Devices

Jun 20, 2024 | Nordson Electronics Solutions

A leading electronic hearing device manufacturer reduced UV precise coating cycle time by 79% with advanced automation. A manual process of hand brushing UV coating onto components was replaced by an automated solution from Nordson to increase production volumes, improve quality, and reduce costs for this complex application. Download the paper to learn the details of the application....

Publisher: ASYMTEK Products | Nordson Electronics Solutions

ASYMTEK Products | Nordson Electronics Solutions

A leader in automated fluid dispensing, jetting, and conformal coating. Products include stand-alone dispensing workstations and fully automated, in-line conveyorized systems with advanced process controls.

Carlsbad, California, USA

Manufacturer

Component Reliability After Long Term Storage

Jun 19, 2024 | R. R. Madsen

Each year the semiconductor industry routes a significant volume of devices to recycling sites for no reliability or quality rationale beyond the fact that those devices were stored on a warehouse shelf for two years. This study identifies the key risks attributed to extended storage of devices in uncontrolled indoor environments and the risk mitigation required to permit safe shelf-life extension. Component reliability was evaluated after extended storage to assure component solderability, MSL stability and die surface integrity. Packing materials were evaluated for customer use parameters as well as structural integrity and ESD properties. Results show that current packaging material (mold compound and leadframe) is sufficiently robust to protect the active integrated circuits for many decades and permit standard reflow solder assembly beyond 15 years. Standard packing materials (bags, desiccant, and humidity cards) are robust for a 32 month storage period that can be extended by repacking with fresh materials. Packing materials designed for long term storage are effective for more than five years....

Publisher: Texas Instruments

Texas Instruments

Advance in DSP technology and design/applications

Baguio City, USA

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