Equipment Impacts of Lead Free Wave Soldering
Published: |
April 18, 2003 |
Author: |
Jim Morris, Advanced Development Manager, Cookson Electronics Equipment & Matthew J. O'Keefe, Ph.D., Associate Professor of Metallurgical Engineering, University of Missouri |
Abstract: |
The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today's Wave Solder systems. Users are experiencing higher maintenance frequency and reduced life of wave solder machine components. This paper describes the effects of Sn rich solders in contact with various materials and discusses alternate methods to alleviate this problem.... |
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