New BGA Solder Mask Repair Technique Using Laser Cut Stencils
Published: |
February 1, 2007 |
Author: |
Ronald D. Schaeffer, Chief Executive Officer, Photomachining. |
Abstract: |
The increased replacement of high lead count SMT devices with BGAs and other high ball count area array packages has brought increased challenges to PCB rework and repair. Often solder mask areas surrounding BGA pad areas are damaged when components are removed.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from BEST Inc. »
- May 29, 2019 - Hand Printing using Nanocoated and other High End Stencil Materials
- Mar 30, 2017 - Solder Paste for BGA Rework | Multiple Methods for Applying Paste Flux
- Feb 01, 2017 - BGA Rework Process
- Oct 06, 2016 - PCB Laser Depanelizing Using a UV Laser
- Aug 27, 2015 - Adhesive Backed Plastic Stencils vs Mini Metal Stencils
- See all SMT / PCB technical articles from BEST Inc. »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
New BGA Solder Mask Repair Technique Using Laser Cut Stencils article has been viewed 796 times
 hitech.gif)
