Liquid Tin Corrosion and Lead Free Wave Soldering

Published:

February 12, 2008

Author:

Jim Morris, Speedline Technologies, Matthew J. O’Keefe, Ph.D., University of Missouri

Abstract:

Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The latest trends in protecting wave solder machine components from liquid metal corrosion by lead free solder alloys will be presented in order to provide guidelines for evaluating existing equipment as well as for purchasing new systems....

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Company Information:

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Adhesives / Dispensing, Cleaning, Manufacturer of Assembly Equipment, Screen Printing, Soldering

  • Phone 5085414749
  • Fax 5085202288

Speedline Technologies, Inc. website

Company Postings:

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(19) news releases

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