If you bear the cost of your product's failure, shouldn't you have a say in ensuring it's success?
Published: |
April 9, 2009 |
Author: |
ECD |
Abstract: |
Evidence has come to light that increased solder process temperatures, specifically for lead free solder, are dramatically shortening life expectancy of components; failures do not show up during initial test, but much later on in the products life, ... |
We apologize but the original text of this article is no longer available. |
|
You must be a registered user to talk back to us. |
Company Information:
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
If you bear the cost of your product's failure, shouldn't you have a say in ensuring it's success? article has been viewed 653 times