Screen and Stencil Printing Processes for Wafer Backside Coating

Published:

September 9, 2009

Author:

Mark Whitmore, Jeff Schake.

Abstract:

Stencil printing equipment has traditionally been used in the surface mount assembly industry for solder paste printing. In recent years the flexibility of the tool has been exploited for a wide range of materials and processes to aid semiconductor packaging and assembly. One such application has been the deposition of adhesive coatings onto the backside of silicon wafers....

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Company Information:

The ASM SMT Solutions segment is made up of SMT Printing Solutions (DEK) and SMT Placement Solutions (SIPLACE). Under the DEK brand, it sells best-in-class printing solutions for the electronics and solar industries.

Suwanee, Georgia, USA

Manufacturer

  • Phone +1 770 797-3000

See Company Website »

Company Postings:

(10) products in the catalog

(7) technical library articles

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