Pad Cratering - The Invisible Threat to the Electronics Industry
Published: |
September 6, 2012 |
Author: |
Chris Hunrath |
Abstract: |
First published in the 2012 IPC APEX EXPO technical conference proceedings. Pad Cratering opens circuits. This occurs when the resin crack (fracture) migrates through a copper trace or via. This happens at assembly, in service or during handling. When com... |
September 10, 2012 The resilient material (Zeta® Cap) is added in the process of building the circuit board in place of the copper foil. The Zeta Cap is a copper and c-staged polyimide that is very easy for the PCB Fabricator use as a cap layer on the outer layer of the PCB to improve the Pad Cratering resistance. The designer should specify Zeta Cap on the print. Thank you for your questions. September 11, 2012 Davef, we know there are several drivers creating pad cratering in PCB Assemblies. By adding Zeta Cap to the PCB we have data from several reliable sources that have shown we can and do improve the resistance to pad cratering in the PCB assembly whether or not the pad crater is initiated by bend and flex, thermal shock or drop testing. You must be a registered user to talk back to us. |
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Pad Cratering - The Invisible Threat to the Electronics Industry article has been viewed 762 times
Ag
September 10, 2012
So, how does this resilient material become an element of a fabricated board? * Does the board designer specify it to the fabricator? * Does the designer do a callout for a resilient design and the the fabricator selects the material? * Or what?