Enhancing Mechanical Shock Performance Using Edgebond Technology
Published: |
June 26, 2014 |
Author: |
Steven Perng, Tae-Kyu Lee, and Cherif Guirguis - Cisco Systems, Inc., Edward S. Ibe - Zymet, Inc. |
Abstract: |
Edgebond adhesives have been widely used by the industry for improving the shock performance of area array packages. Most of the studies focus on the impact of material properties, such as coefficient of thermal expansion (CTE) and glass transition temperature (Tg), on reliability at room temperature. However, the operating temperature of a component on the printed circuit board bonded with edgebond adhesive can be close to or exceed Tg of the adhesive, where the material properties may be very different than at room temperature.... |
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