Predicting Fatigue of Solder Joints Subjected to High Number of Power Cycles
Published: |
July 9, 2015 |
Author: |
Craig Hillman, Nathan Blattau, Matt Lacy |
Abstract: |
Solder joint reliability of SMT components connected to printed circuit boards is well documented. However, much of the testing and data is related to high-strain energy thermal cycling experiments relevant to product qualification testing (i.e., -55C to 125C). Relatively little information is available on low-strain, high-cycle fatigue behavior of solder joints, even though this is increasingly common in a number of applications due to energy savings sleep mode, high variation in bandwidth usage and computational requirements, and normal operational profiles in a number of power supply applications. In this paper, 2512 chip resistors were subjected to a high (>50,000) number of short duration (<10 min) power cycles. Environmental conditions and relevant material properties were documented and the information was inputted into a number of published solder joint fatigue models. The requirements of each model, its approach (crack growth or damage accumulation) and its relevance to high cycle fatigue are discussed.... |
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