PCB Fabrication Processes and Their Effects on Fine Copper Barrel Cracks

Published:

December 23, 2015

Author:

Edward Arthur, Charles Busa, Melissa Durfee, Chad Gibson, Wade Goldman P.E.; Raytheon Company, Space and Airborne Systems, The Charles Stark Draper Laboratory, Inc., Raytheon Company, Integrated Defense Systems.

Abstract:

The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects, the causes of copper barrel cracks in printed circuit board (PCB) plated through holes is not well understood. Accordingly, there is a need to determine what affects the onset of barrel cracks and then control those causes to mitigate their initiation.

The objective of this research is to conduct a design of experiment (DOE) to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks. The test vehicle used will be a 16-layer epoxy-based PCB that has two different sized plated through holes as well as buried vias....

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Company Information:

Raytheon

The Raytheon Company is a major American defense contractor and industrial corporation with core manufacturing concentrations in weapons and military and commercial electronics.

Waltham, Massachusetts, USA

Other

  • Phone 978-470-7238

Raytheon website

Company Postings:

(4) technical library articles

(1) news release

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