PCB Fabrication Processes and Their Effects on Fine Copper Barrel Cracks
Published: |
December 23, 2015 |
Author: |
Edward Arthur, Charles Busa, Melissa Durfee, Chad Gibson, Wade Goldman P.E.; Raytheon Company, Space and Airborne Systems, The Charles Stark Draper Laboratory, Inc., Raytheon Company, Integrated Defense Systems. |
Abstract: |
The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects, the causes of copper barrel cracks in printed circuit board (PCB) plated through holes is not well understood. Accordingly, there is a need to determine what affects the onset of barrel cracks and then control those causes to mitigate their initiation. The objective of this research is to conduct a design of experiment (DOE) to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks. The test vehicle used will be a 16-layer epoxy-based PCB that has two different sized plated through holes as well as buried vias.... |
|
|
|
|
|
|
You must be a Company Information:
- Oct 12, 2017 - Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin
- Nov 30, 2016 - Review of Interconnect Stress Testing Protocols and Their Effectiveness in Screening Microvias
- Jun 04, 2015 - Tin Whisker Risk Mitigation for High-Reliability Systems Integrators and Designers
- See all SMT / PCB technical articles from Raytheon »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
PCB Fabrication Processes and Their Effects on Fine Copper Barrel Cracks article has been viewed 961 times
 hitech.gif)
