Materials Compatibility and Aging for Flux and Cleaner Combination
Published: |
May 30, 2016 |
Author: |
Kim M. Archuleta, Rochelle Piatt |
Abstract: |
New engineered cleaning and defluxing agents promise great improvement in cleaning and reliability for electronic assemblies. As complexity grows and dimensions shrink in high reliability electronics, the need for materials compatibility and effectiveness in cleaning and rinsing is vital.... |
|
Company Information:
More articles from Sandia National Laboratories »
- Mar 02, 2022 - Effects Of Storage Environments On The Solderability Of Nickel Palladium- Gold Finish With Pb-Based And Pb- Free Solders
- See all SMT / PCB technical articles from Sandia National Laboratories »
More SMT / PCB assembly technical articles »
- Jan 17, 2023 - Introducing Closed-loop Nitrogen Control To Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - How Challenging Conventional Wisdom Can Optimize Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - The User Benefits of a Supplier Partnership | Heller Industries Inc.
- Jan 17, 2023 - Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications | Heller Industries Inc.
- Jan 17, 2023 - Flux Management | Heller Industries Inc.
- Browse Technical Library »
Materials Compatibility and Aging for Flux and Cleaner Combination article has been viewed 524 times