Materials Compatibility and Aging for Flux and Cleaner Combination
Published: |
May 30, 2016 |
Author: |
Kim M. Archuleta, Rochelle Piatt |
Abstract: |
New engineered cleaning and defluxing agents promise great improvement in cleaning and reliability for electronic assemblies. As complexity grows and dimensions shrink in high reliability electronics, the need for materials compatibility and effectiveness in cleaning and rinsing is vital.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Sandia National Laboratories »
- Jun 19, 2024 - EFFECTS OF STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF NICKELPALLADIUM-GOLD FINISH WITH Pb-BASED AND PbFREE SOLDERS
- Mar 02, 2022 - Effects Of Storage Environments On The Solderability Of Nickel Palladium- Gold Finish With Pb-Based And Pb- Free Solders
- See all SMT / PCB technical articles from Sandia National Laboratories »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Materials Compatibility and Aging for Flux and Cleaner Combination article has been viewed times