Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling
Published: |
November 30, 2016 |
Author: |
Katherine Wilkerson, Ian J. Wilding, Michael Carter, Daniel Buckland |
Abstract: |
Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling. This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Henkel Electronic Materials »
- Nov 10, 2020 - Printed Electronics for Medical Devices
- Oct 14, 2020 - FRACTURE TOUGHNESS OF THERMALLY CONDUCTIVE ADHESIVES
- Mar 10, 2011 - Solder Materials Science Gets Small as Miniaturization Challenges Old Rules
- Sep 23, 2010 - Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers
- Jan 06, 2010 - Advanced Thermal Interface Materials for Enhanced Flip Chip BGA
- See all SMT / PCB technical articles from Henkel Electronic Materials »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling article has been viewed 1065 times
.gif)
