A Novel Solution for No-Clean Flux not Fully Dried under Component Terminations

Published:

August 17, 2017

Author:

Dr. Ning-Cheng Lee & Fen Chen

Abstract:

At SMT assembly, flux outgassing/drying is difficult for devices with poor venting channel, and resulted in insufficiently dried/burnt-off flux residue for no-clean process.

Examples including:

  • Large low stand-off components such as QFN, LGA
  • Components covered under electromagnetic shield which has either no or few venting holes
  • Components assembled within cavity of board
  • Any other devices with small open space around solder joints
...

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Company Information:

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

  • Phone 315-853-4900
  • Fax 315-853-1000

Indium Corporation website

Company Postings:

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