A Novel Solution for No-Clean Flux not Fully Dried under Component Terminations
Published: |
August 17, 2017 |
Author: |
Dr. Ning-Cheng Lee & Fen Chen |
Abstract: |
At SMT assembly, flux outgassing/drying is difficult for devices with poor venting channel, and resulted in insufficiently dried/burnt-off flux residue for no-clean process. Examples including:
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