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Board-Level Thermal Cycling and Drop-Test Reliability of Large, Ultrathin Glass BGA Packages for Smart Mobile Applications

Published:

August 22, 2018

Author:

Bhupender Singh, Gary Menezes, Scott McCann, Vidya Jayaram, Urmi Ray, Venky Sundaram, Raj Pulugurtha, Vanessa Smet, Rao Tummala

Abstract:

Glass substrates are emerging as a key alternative to silicon and conventional organic substrates for high-density and high-performance systems due to their outstanding dimensional stability, enabling sub-5-µm lithographic design rules, excellent electrical performance, and unique mechanical properties, key in achieving board-level reliability at body sizes larger than 15 × 15 mm2.

This paper describes the first demonstration of the board-level reliability of such large, ultrathin glass ball grid array (BGA) packages directly mounted onto a system board, considering both their thermal cycling and drop-test performances....

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Company Information:

Institute of Electrical and Electronics Engineers (IEEE)

IEEE is the world's largest professional association dedicated to advancing technological innovation and excellence for the benefit of humanity.

Piscataway, New Jersey, USA

Association, Non-Profit

  • Phone 732-981-0060

Institute of Electrical and Electronics Engineers (IEEE) website

Company Postings:

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