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Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction

Published:

September 26, 2018

Author:

Carlos Tafoya, Gustavo Ramirez, Timothy O’Neill

Abstract:

Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages....

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Company Information:

AIM Solder

AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.

Montreal, Quebec, Canada

Manufacturer of Assembly Material, Soldering

  • Phone +1-514-494-2000

AIM Solder website

Company Postings:

(44) products in the catalog

(13) technical library articles

(47) news releases

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  • Dec 07, 2017 - Utility of Dual Applicators for Non-Atomized Conformal Coating to Improve High-Volume Manufacturing Optimization | Nordson ASYMTEK
  • Nov 08, 2017 - Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate | kurtz ersa Corporation
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