Process Optimization for Fine Feature Solder Paste Dispensing

Published:

December 19, 2018

Author:

Maria Durham, Greg Wade, and Brandon Judd; Indium Corporation, John Boggiatto; ITW EAE - Speedline Technologies

Abstract:

With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology, it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such as those involving chip capacitors or BGA packages, as well as dispensing ultra-fine lines in MEMs lid-attach applications. In order to achieve ultra-fine dots and fine line widths while dispensing solder paste, both the solder material and dispensing equipment need to be optimized. Optimizing the equipment can be very challenging, as there are many input variables that can affect the dispense quality of the solder paste. In this paper we will evaluate the many equipment variables involved in the solder paste dispensing process, and the impact these variables have on the dispense quality of the solder paste....

  • Download Process Optimization for Fine Feature Solder Paste Dispensing article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

  • Phone 315-853-4900
  • Fax 315-853-1000

Indium Corporation website

Company Postings:

(9) products in the catalog

(24) technical library articles

(278) news releases

  • May 24, 2019 - Decapsulation of Integrated Circuits | ACI Technologies, Inc.
  • May 24, 2019 - Coating Application Methods | ACI Technologies, Inc.
  • May 24, 2019 - Preparation for Reflow Profiling | ACI Technologies, Inc.
  • May 23, 2019 - Identifying Flux Residues | ACI Technologies, Inc.
  • May 23, 2019 - Cleaning | ACI Technologies, Inc.
  • Browse Technical Library »

Process Optimization for Fine Feature Solder Paste Dispensing article has been viewed 357 times

3 day PCB Assembly

MPM SMT screen printer parts