Process Optimization for Fine Feature Solder Paste Dispensing
Published: |
December 19, 2018 |
Author: |
Maria Durham, Greg Wade, and Brandon Judd; Indium Corporation, John Boggiatto; ITW EAE - Speedline Technologies |
Abstract: |
With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology, it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such as those involving chip capacitors or BGA packages, as well as dispensing ultra-fine lines in MEMs lid-attach applications. In order to achieve ultra-fine dots and fine line widths while dispensing solder paste, both the solder material and dispensing equipment need to be optimized. Optimizing the equipment can be very challenging, as there are many input variables that can affect the dispense quality of the solder paste. In this paper we will evaluate the many equipment variables involved in the solder paste dispensing process, and the impact these variables have on the dispense quality of the solder paste.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Indium Corporation »
- Jul 24, 2024 - Pad Design and Process for Voiding Control at QFN Assembly
- Oct 11, 2022 - LEAD-FREE FLUX TECHNOLOGY AND INFLUENCE ON CLEANING
- Jan 03, 2021 - Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies
- Nov 24, 2020 - The Risk And Solution For No-Clean Flux Not Fully Dried Under Component Terminations the Risk And Solution For No-Clean Flux Not Fully Dried Under Component Terminations
- Jul 24, 2019 - Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies
- See all SMT / PCB technical articles from Indium Corporation »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Process Optimization for Fine Feature Solder Paste Dispensing article has been viewed 1373 times