Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Published: |
April 17, 2019 |
Author: |
Reza Ghaffarian, Ph.D. |
Abstract: |
Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This paper presents the reliability of land grid array (LGA) component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Jet Propulsion Laboratory »
- Jul 30, 2019 - Design Parameters Influening Reliability of CCGA Assembly; a Sensitivity Analysis
- Dec 12, 2018 - Assembly Reliability of TSOP/DFN PoP Stack Package
- Jun 22, 2017 - Defect Features Detected by Acoustic Emission for Flip-Chip CGA/FCBGA/PBGA/FPBGA Packages and Assemblies
- Jan 02, 2014 - Thermal Shock and Drop Test Performance of Lead-free Assemblies with No-Underfill and Corner-Underfill
- Mar 14, 2013 - Assembly and Reliability of 1704 I/O FCBGA and FPBGAs
- See all SMT / PCB technical articles from Jet Propulsion Laboratory »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Reliability of ENEPIG by Sequential Thermal Cycling and Aging article has been viewed 931 times
