Use of Pelseal® 2078 Viton® Caulk in Decapsulation of Electronics Components
Published: |
June 18, 2019 |
Author: |
ACI Technologies, Inc. |
Abstract: |
ACI Technologies is tasked with decapsulation of electronics components for testing and investigative purposes. In the normal method of decapsulation, an analyst will drill a small indentation, with a rotary tool, in the hermetic sealant material and then apply Nitric acid to eat through the polymeric encapsulant.... |
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