Automated Testing with Boundary Scan
Published: |
August 19, 2019 |
Author: |
ACI Technologies, Inc. |
Abstract: |
Boundary scan is a method for testing interconnects on printed circuit boards (PCBs) or sub-blocks inside an integrated circuit. It has rapidly become the technology of choice for building reliable high technology electronic products with a high degree of testability. Due to the low-cost and integrated circuit (IC) level access capabilities of boundary scan, its use has expanded beyond traditional board test applications into product design and service.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from ACI Technologies, Inc. »
- Dec 07, 2020 - A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested
- Nov 09, 2020 - Ball Grid Array (BGA) Voiding Affecting Functionality
- Sep 02, 2020 - Reworking ALD Coatings
- Aug 05, 2020 - ALD of Alumina Ceramic Films for Hermetic Protection
- Jul 01, 2020 - Lead-Free Risk Mitigation -- A Case Study
- See all SMT / PCB technical articles from ACI Technologies, Inc. »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Automated Testing with Boundary Scan article has been viewed 665 times
