Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies

Published:

January 22, 2020

Author:

Gonzalo Fernandez, Ana Collado

Abstract:

Flip chip assembly techniques bring a wide range of benefits:

  • Reduced parasitic interconnection between the semiconductor die and package.
  • Provides a high final assembly integrity density.
  • Minimize the interconnection length, providing better electrical performances, especially for high speed signals.
  • Reduce the device size and weight,…, etc.

But there is no dedicated inspection requirements nor DPA standard which address all the necessary aspects associated to this construction type or only cover partially the topics to be inspected....

  • Download Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

ALTER TECHNOLOGY

A leading company in the fields of engineering, procurement and testing of high reliability components and electronic equipment within the space and other high reliability markets.

41092, Spain

Test Services

  • Phone +34 95 446 70 50

ALTER TECHNOLOGY website

Company Postings:

(1) technical library article

  • Aug 05, 2020 - ALD of Alumina Ceramic Films for Hermetic Protection | ACI Technologies, Inc.
  • Jul 01, 2020 - Lead-Free Risk Mitigation -- A Case Study | ACI Technologies, Inc.
  • Jun 02, 2020 - Lead-Free Control Plan | ACI Technologies, Inc.
  • May 08, 2020 - Pad Cratering | ACI Technologies, Inc.
  • Apr 14, 2020 - Reliable Selective Soldering For High Volume Assemblies | ITW EAE
  • Browse Technical Library »

Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies article has been viewed 217 times

Selective Conformal Coating System - GPD SimpleCoat

Selective Conformal Coating System