Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies

Flip chip assembly techniques bring a wide range of benefits:

• Reduced parasitic interconnection between the semiconductor die and package.
• Provides a high final assembly integrity density.
• Minimize the interconnection length, providing better electrical performances, especially for high speed signals.
• Reduce the device size and weight,…, etc.

But there is no dedicated inspection requirements nor DPA standard which address all the necessary aspects associated to this construction type or only cover partially the topics to be inspected....