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Process Engineering - Why is preparation of adhesive bonding and potting materials necessary?

Published:

February 14, 2020

Author:

Scheugenpflug

Abstract:

To meet the steady increase in technical requirements for electronic components, potting media properties must be extremely precise. Rheology, viscosity, filler content and curing behavior are only a few of the factors that play a role in their practical use. However, the growing complexity of materials often negatively impacts the ability to process or dispense them. In this case, material preparation and feeding systems specially designed for this purpose are required. These systems optimally prepare the material for the actual application and ensure homogeneous feeding to the dispensing system....

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Company Information:

Producer of bonding, dispensing and potting solutions with outstanding expertise in automation. As part of the Atlas Copco Group, we have a worldwide sales & service network and access to the Group's extensive technology portfolio

Kennesaw, Georgia, USA

Manufacturer

  • Phone 7702180835
  • Fax 7702180931

See Company Website »

Company Postings:

(14) products in the catalog

(2) upcoming training courses

(21) technical library articles

(16) news releases

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