Filling of Microvias and Through Holes by Electrolytic Copper Plating –Current Status and Future Outlook
Published: |
March 12, 2020 |
Author: |
Mustafa Özkök, Sven Lamprecht, Akif Özkök, Dolly Akingbohungbe, Moody Dreiza - Atotech Deutschland GmbH, Alex Stepinski - GreenSource Fabrication LLC |
Abstract: |
The electronics industry is further progressing in terms of smaller, faster, smarter and more efficient electronic devices. This continuous evolving environment caused the development on various electrolytic copper processes for different applications over the past several decades. (...) This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs.... |
|
|
|
|
|
|
You must be a - Nov 15, 2020 - Designing a High Performance Electroless Nickel and Immersion Gold to Maximize Highest Reliability
- Sep 02, 2020 - Developments in Electroless Copper Processes to Improve Performance in amSAP Mobile Applications
- Sep 19, 2019 - How Detrimental Production Concerns Related to Solder Mask Residues Can Be Countered by Simple Operational Adaptations
- Apr 10, 2019 - Soldering Immersion Tin
- Apr 20, 2017 - High Throw Electroless Copper - Enabling new Opportunities for IC Substrates and HDI Manufacturing
- See all SMT / PCB technical articles from Atotech »
More SMT / PCB assembly technical articles »
- Jan 03, 2021 - Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies | SMTnet
- Dec 07, 2020 - A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested | ACI Technologies, Inc.
- Dec 02, 2020 - SMT007-MIRTEC Intelligent Factory Automation Article-November 2020 | MIRTEC Corp
- Nov 09, 2020 - Ball Grid Array (BGA) Voiding Affecting Functionality | ACI Technologies, Inc.
- Nov 04, 2020 - Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection? | ZESTRON Americas
- Browse Technical Library »
Filling of Microvias and Through Holes by Electrolytic Copper Plating –Current Status and Future Outlook article has been viewed 501 times
