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Filling of Microvias and Through Holes by Electrolytic Copper Plating –Current Status and Future Outlook

Published:

March 12, 2020

Author:

Mustafa Özkök, Sven Lamprecht, Akif Özkök, Dolly Akingbohungbe, Moody Dreiza - Atotech Deutschland GmbH, Alex Stepinski - GreenSource Fabrication LLC

Abstract:

The electronics industry is further progressing in terms of smaller, faster, smarter and more efficient electronic devices. This continuous evolving environment caused the development on various electrolytic copper processes for different applications over the past several decades. (...) This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs....

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Company Information:

Atotech

One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.

Berlin, Germany

Components / Substrates, Manufacturer of Assembly Material, Manufacturer of Components

  • Phone (+49) 30-349 85-0
  • Fax (+49) 30-349 85-777

Atotech website

Company Postings:

(2) products in the catalog

(12) technical library articles

(1) news release

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