Filling of Microvias and Through Holes by Electrolytic Copper Plating –Current Status and Future Outlook
Published: |
March 12, 2020 |
Author: |
Mustafa Özkök, Sven Lamprecht, Akif Özkök, Dolly Akingbohungbe, Moody Dreiza - Atotech Deutschland GmbH, Alex Stepinski - GreenSource Fabrication LLC |
Abstract: |
The electronics industry is further progressing in terms of smaller, faster, smarter and more efficient electronic devices. This continuous evolving environment caused the development on various electrolytic copper processes for different applications over the past several decades. (...) This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs.... |
|
|
|
|
|
|
You must be a - Sep 19, 2019 - How Detrimental Production Concerns Related to Solder Mask Residues Can Be Countered by Simple Operational Adaptations
- Apr 10, 2019 - Soldering Immersion Tin
- Apr 20, 2017 - High Throw Electroless Copper - Enabling new Opportunities for IC Substrates and HDI Manufacturing
- Nov 06, 2014 - Effect of Process Variations on Solder Joint Reliability for Nickel-based Surface Finishes
- Oct 11, 2012 - Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd-Layers
- See all SMT / PCB technical articles from Atotech »
More SMT / PCB assembly technical articles »
- Apr 01, 2020 - Product Design and Early Manufacturing Involvement | ACI Technologies, Inc.
- Apr 01, 2020 - 1Click SMT Made Successful Installation and Training For Thai Customer! | 1 CLICK SMT TECHNOLOGY CO., Limited
- Mar 24, 2020 - DA-1200 THT automated inspection system service report | 1 CLICK SMT TECHNOLOGY CO., Limited
- Mar 12, 2020 - IPC Apex Expo 2020 Remarks | SMTnet
- Mar 09, 2020 - Cleaning No-Clean Fluxes Prior to Conformal Coating | ACI Technologies, Inc.
- Browse Technical Library »
Filling of Microvias and Through Holes by Electrolytic Copper Plating –Current Status and Future Outlook article has been viewed 187 times
