Moisture Absorption Properties of Laminates Used in Chip Packaging Applications

Published:

November 29, 2020

Author:

Gordon Smith, Nancy Androff, and Jeff Kamla

Abstract:

Plastic laminates are increasingly used as interposers within chip packaging applications. As a component within the package, the laminate is subjected to package moisture sensitivity testing. The moisture requirements of chip packaging laminates are related to ambient moisture absorption and thermal cycling. Printed wiring board (PWB) laminates, however, are gauged on properties relating to wet processes such as resist developing, copper etching, and pumice scrubbing. Consequently, printed wiring board moisture absorption test methods differ from chip packaging test conditions....

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Company Information:

Isola Group

Isola a global material sciences company focused on designing, developing, manufacturing and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer PCBs.

Chandler, Arizona, USA

Laminates

  • Phone 480-893-6527
  • Fax 480-893-1409

Isola Group website

Company Postings:

(1) product in the catalog

(2) technical library articles

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