A Study On Process, Strength And Microstructure Analysis Of Low Temperature SnBi Containing Solder Pastes Mixed With Lead-Free Solder Balls
Published: |
August 25, 2021 |
Author: |
Sakthi Cibi Kannammal Palaniappan and Martin.K.Anselm, Ph.D. |
Abstract: |
As the traditional eutectic SnPb solder alloy has been outlawed, the electronic industry has almost completely transitioned to the lead-free solder alloys. The conventional SAC305 solder alloy used in lead-free electronic assembly has a high melting and processing temperature with a typical peak reflow temperature of 245ºC which is almost 30ºC higher than traditional eutectic SnPb reflow profile. Some of the drawbacks of this high melting and processing temperatures are yield loss due to component warpage which has an impact on solder joint formation like bridging, open defects, head on pillow.... |
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