Effect Of Silver In Common Lead-Free Alloys

Published:

September 8, 2021

Author:

Ranjit Pandher, Tom Lawlor

Abstract:

There is need in the industry to understand the effects of silver presence in solders from various applications perspective. This article will attempt to present a review of the key published results on the silver containing alloys along with results of our internal studies on wave soldering, surface mount and BGA/CSP applications. Advantages and disadvantages of silver at different levels will be discussed. Specifically this report will focus on the effect of silver on process conditions, drop shock resistance, solder joint survivability in high strain rate situations, thermal fatigue resistance, Cu dissolution and effects of silver in combination with other alloy additives. Specific application problems demanding high silver level and other requiring silver level to the minimum will be discussed....

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Leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide.

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