The Challenges Of Package On Package (Pop) Devices During Assembly And Inspection

Published:

December 16, 2021

Author:

Bob Willis, David Bernard

Abstract:

Ball Grid Array devices, BGAs, are widely used in a vast range of products including consumer, telecommunications and office based systems. As an area array device of solder joints, it provides high packing density with a relatively easy introduction cycle. However, over the last couple of years engineers have started to experiment, and in some cases implement, stacked packages, of the type often called Package on Package, or POP. In simple terms, POP devices are the stacking of components, one on top of the other, either during the original component manufacture or during printed board assembly....

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(1) technical library article

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