Investigation of Impacts on Printed Circuit Board Laminated Composites Caused by Surface Finish Application
Published: |
December 29, 2021 |
Author: |
Denis Froš , Karel Dušek and Petr Veselý |
Abstract: |
The purpose of this study was to compare the strength of the bond between resin and glass cloth for various composites (laminates) and its dependence on utilized soldering pad surface finishes. Moreover, the impact of surface finish application on the thermomechanical properties of the composites was evaluated. Three different laminates with various thermal endurances were included in the study. Soldering pads were covered with OSP and HASL surface finishes. The strength of the cohesion of the resin upper layer was examined utilizing a newly established method designed for pulling tests.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Czech Technical University in Prague »
- Dec 05, 2022 - Latent heat induced deformation of PCB substrate: Measurement and simulation
- See all SMT / PCB technical articles from Czech Technical University in Prague »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Investigation of Impacts on Printed Circuit Board Laminated Composites Caused by Surface Finish Application article has been viewed 392 times