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Effect of Thermal Aging on Solderabilityof ENEPIG Surface Finish Used in Printed Circuit Boards

Published:

December 29, 2021

Author:

MaanBajnaid, Emily Holtzhouser, Jordan Terrell, Lawrence Yeh

Abstract:

Medtronic seeks to quantify the thermal aging limits of electroless Ni-electroless Pd-immersion Au (ENEPIG) surface finishes to determine how aggressive the silicon burn-in process can be without loss of solderability. Silicon burn-in (power testing at elevated temperature) is used to eliminate early field failures, critical for device reliability. Thermal aging due to burn-in or annealing causes Ni and Pd diffusion to and oxidation on the surface. Surface oxides limit wetting of the PbSn solder, affecting electrical connectivity of components soldered afterburn-in. Isothermal aging of two ENEPIG surface finishes was performed at 75°C-150°C for 100 hrs-1500hrs to test the thermal aging limits and identify how loss of solderability occurs....

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Company Information:

Purdue University

An educational institution, Purdue's ECET Department teaches ECAD design, electronic manufacturing, and electronic test including DFT.

West Lafayette, Indiana, USA

  • Phone 765-494-7726

Purdue University website

Company Postings:

(1) technical library article

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