Material & Process Influences on Conductive Anodic Filamentation (CAF)
Published: |
March 16, 2023 |
Author: |
Alun Morgan and Doug Trobough |
Abstract: |
HISTORY: * In the late 1970s an abrupt unpredictable loss of insulation resistance was observed in PCBs, which were subject to hostile climatic conditions of high relative humidity and temperature while having an applied voltage. * The loss of resistance, even leading to a short circuit was observed to be due to the growth of a subsurface filament from the anode to the cathode. * The term "Conductive Anodic Filamentation" (CAF) was coined.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Isola Group »
- Jul 16, 2023 - The Compensation Problem and Solution Using Design of Experiments for Dense Multilayer Printed Circuit Boards
- Dec 21, 2021 - Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing
- Jul 27, 2021 - Conductive Anodic Filament Growth Failure
- Dec 16, 2020 - Making Sense of Laminate Dielectric Properties
- Nov 29, 2020 - Moisture Absorption Properties of Laminates Used in Chip Packaging Applications
- See all SMT / PCB technical articles from Isola Group »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Material & Process Influences on Conductive Anodic Filamentation (CAF) article has been viewed 407 times
